Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.

After an underwhelming end to last year, Micron Technology Inc. shares have been hot to start 2025, rising 18% to lead S&P ...

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

The company has plans to demo its next-gen 16-layer HBM3E prototype alongside a high-capacity enterprise SSD, and new ...

Micron plans to invest around $7 billion over the next five years to boost memory chip production in Singapore. The company ...

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...

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The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total ...

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Set to start operating in 2026, the plant will be used to package high-bandwidth memory chips, a type widely seen in AI data ...