AI accelerators to see the light, literally Lightmatter this week unveiled a pair of silicon photonic interconnects designed ...

Wafer-scale chip designer Cerebras Systems and Canadian silicon photonics firm Ranovus have been awarded a $45 million ...

The silicon photonics startup has announced new products to tackle interconnect bottlenecks costing enterprises millions in ...

AI compute company Cerebras Systems said it has been awarded a new contract from the Defense Advanced Research Projects Agency (DARPA) to develop a system combining their  wafer scale technology with ...

The computing system that Cerebras is building for DARPA will also feature “wafer scale co-packaged optics” from Ranovus. According to Reuters, the latter technology will be used to link together ...

CPO brings optical interconnects right to the chip New architecture shifts the fiber optic connections right to the board Co-packag ...

Lightmatter turbocharges GPU connectivity with its first photonics-based networking interconnects - SiliconANGLE ...

Nvidia CEO Jensen Huang recently addressed the reliability of co-packaged optics, a technology that uses laser light to ...

Lightmatter, the leader in photonic (super)computing, today announced Passage™ L200, the world’s first 3D co-packaged optics (CPO) product. Designed to integrate with the latest XPU and ...

Following Nvidia's (NASDAQ:NVDA) recent announcement at GTC 2025 that it plans to scale artificial intelligence factories ...

AI workloads are rapidly increasing, driving the need for higher bandwidth, lower latency, and more power-efficient optical interconnects. Broadcom is meeting these evolving demands with a ...

Broadcom (AVGO) announced the expansion of its portfolio of optical interconnect solutions to enable AI infrastructure. These innovative ...