Nubis Communications, a leader in high-density optical interconnect solutions for AI networks, and Samtec, the service leader ...

Cerebras integrates wafer scale technology and Ranovus co-packaged optics technology in a new compute platform optimized for ...

CPO brings optical interconnects right to the chip New architecture shifts the fiber optic connections right to the board Co-packag ...

Lightmatter, the leader in photonic (super)computing, today announced Passage™ L200, the world’s first 3D co-packaged optics (CPO) product. Designed to integrate with the latest XPU and switch silicon ...

The computing system that Cerebras is building for DARPA will also feature “wafer scale co-packaged optics” from Ranovus. According to Reuters, the latter technology will be used to link together ...

The silicon photonics startup has announced new products to tackle interconnect bottlenecks costing enterprises millions in ...

AI compute company Cerebras Systems said it has been awarded a new contract from the Defense Advanced Research Projects Agency (DARPA) to develop a system combining their  wafer scale technology with ...

Lightmatter, the leader in photonic (super)computing, today announced Passage™ L200, the world’s first 3D co-packaged optics (CPO) product. Designed to integrate with the latest XPU and ...

ASE said in a press release that as AI applications rapidly expand, energy efficiency has become a key concern for data ...

Wafer-scale chip designer Cerebras Systems and Canadian silicon photonics firm Ranovus have been awarded a $45 million ...

Lightmatter turbocharges GPU connectivity with its first photonics-based networking interconnects - SiliconANGLE ...

Taking the flexible CPX approach allows per-link choice of optics or copper, lowering the barrier to adoption of co-packaged optics. High-Density Silicon Photonics Coming to 200G per Lane With ...