For Q2 2025, the company projects revenue between $21 million and $23 million, with adjusted EBITDA expected to be nominally positive. Management remains cautious due to ongoing market softness but ...

TAICHUNG, Taiwan, Jan 16 (Reuters) - Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

This tool supports various panel sizes ... creating next generation solutions for a variety of markets including Advanced Packaging for AI and HPC, Memory Systems and Life Sciences.

Shi added that advanced packaging related to CapEx will grow faster ... will start to take tools by the end of 2025. Taiwan Semiconductor in the past said that the second fab in Arizona will ...