For Q2 2025, the company projects revenue between $21 million and $23 million, with adjusted EBITDA expected to be nominally positive. Management remains cautious due to ongoing market softness but ...

TAICHUNG, Taiwan (Reuters) - Nvidia's (NVDA) demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang ...

Shi added that advanced packaging related to CapEx will grow faster ... will start to take tools by the end of 2025. Taiwan Semiconductor in the past said that the second fab in Arizona will ...

This tool supports various panel sizes ... creating next generation solutions for a variety of markets including Advanced Packaging for AI and HPC, Memory Systems and Life Sciences.