GlobalFoundries in Malta will create a new center for semiconductor manufacturing, Governor Kathy Hochul announced on Friday.

GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an ...

The funds will enable new technologies to be validated and transitioned at scale.

GlobalFoundries (GFS) announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New ...

The department announced Friday it had finalized a $93 million award to Infinera as part of the CHIPS and Science Act.

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

This will be an incredible year for innovation, driven by AI and for AI, and pushing the limits of fundamental physics.

Nvidia (NASDAQ:NVDA), the U.S. AI chip giant, continues to demand advanced packaging from Taiwan Semiconductor Manufacturing ...

The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors are protected.

Bakcycle recycles flexible packaging at the highest quality using Tomra technologies: Norway: Bakcycle Recycling, founded by Bakioglu ...