Global semi sales; 3rd CHIPS Act flagship; UFS and memory standards; Chinese military companies in U.S.; TSVs; CES; 18 new ...

American tech giant Micron Technology has broken ground for what will be Singapore’s first plant producing advanced ...

Shares of Micron (NASDAQ: MU) were among the winners this week after the memory-chip specialist benefited from general ...

After an underwhelming end to last year, Micron Technology Inc. shares have been hot to start 2025, rising 18% to lead S&P ...

Micron Technology revealed a plan to invest $7 billion for a new high-bandwidth memory (HBM) packaging plant in Singapore.

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

American tech giant Micron Technology has broken ground for its S$9.5 billion (US$7 billion) high-bandwidth memory (HBM) ...

SK Telecom (SKT) introduced its Aster personal artificial intelligence (AI) agent to participants at the CES 2025 tech fair ...

Set to start operating in 2026, the plant will be used to package high-bandwidth memory chips, a type widely seen in AI data ...

Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) in ...

Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.

Micron Technology, Inc. (NASDAQ: MU) broke ground on a new HBM advanced packaging facility in Singapore, expanding its capacity and creating jobs.