One of the biggest advantages of this approach, Lightmatter says, is that communications between chips aren't limited to a so ...

The computing system that Cerebras is building for DARPA will also feature “wafer scale co-packaged optics” from Ranovus. According to Reuters, the latter technology will be used to link together ...

Quantifi Photonics QCA Series High-Speed Communication Analyzer and QCR Series Clock Recovery Instrument SAN FRANCISCO, CA, UNITED STATES, Apr ...

CPO brings optical interconnects right to the chip New architecture shifts the fiber optic connections right to the board Co-packag ...

The silicon photonics startup has announced new products to tackle interconnect bottlenecks costing enterprises millions in ...

Lightmatter has released two pieces of technology that are aimed at speeding up the connections between AI chips.

Cerebras Systems, the pioneer in accelerating generative AI, has been awarded a new contract from the Defense Advanced ...

Lumentum today delivers best-in-class transmit and receive components designed to meet the demands of next-generation AI data centers. Transitioning from 100 Gbps to 200 Gbps lane speed enables data ...

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Lightmatter, the leader in photonic (super)computing, today announced Passage™ L200, the world’s first 3D co-packaged optics (CPO) product. Designed to integrate with the latest XPU and switch silicon ...

Lightmatter turbocharges GPU connectivity with its first photonics-based networking interconnects - SiliconANGLE ...

AI workloads are rapidly increasing, driving the need for higher bandwidth, lower latency, and more power-efficient optical interconnects. Broadcom is meeting these evolving demands with a ...