Cerebras integrates wafer scale technology and Ranovus co-packaged optics technology in a new compute platform optimized for ...

CPO brings optical interconnects right to the chip New architecture shifts the fiber optic connections right to the board Co-packag ...

The computing system that Cerebras is building for DARPA will also feature “wafer scale co-packaged optics” from Ranovus. According to Reuters, the latter technology will be used to link together ...

Nubis Communications, a leader in high-density optical interconnect solutions for AI networks, and Samtec, the service leader ...

Cerebras Systems, the pioneer in accelerating generative AI, has been awarded a new contract from the Defense Advanced ...

Following Nvidia's (NVDA) recent announcement at GTC 2025 that it plans to scale artificial intelligence factories with ...

The silicon photonics startup has announced new products to tackle interconnect bottlenecks costing enterprises millions in ...

ASE said in a press release that as AI applications rapidly expand, energy efficiency has become a key concern for data ...

Sivers Semiconductors has announced a partnership with O-Net Technologies to produce high-performance external laser sources, ...

Lightmatter, the leader in photonic (super)computing, today announced Passage™ L200, the world’s first 3D co-packaged optics (CPO) product. Designed to integrate with the latest XPU and ...

One of the biggest advantages of this approach, Lightmatter says, is that communications between chips aren't limited to a so ...

Lightmatter turbocharges GPU connectivity with its first photonics-based networking interconnects - SiliconANGLE ...