One of the biggest advantages of this approach, Lightmatter says, is that communications between chips aren't limited to a so ...
The computing system that Cerebras is building for DARPA will also feature “wafer scale co-packaged optics” from Ranovus. According to Reuters, the latter technology will be used to link together ...
Quantifi Photonics QCA Series High-Speed Communication Analyzer and QCR Series Clock Recovery Instrument SAN FRANCISCO, CA, UNITED STATES, Apr ...
CPO brings optical interconnects right to the chip New architecture shifts the fiber optic connections right to the board Co-packag ...
Molex’s VersaBeam expanded beam optical connectors offer options to integrate 12, 16 or 144 fibers for hyperscale data ...
The silicon photonics startup has announced new products to tackle interconnect bottlenecks costing enterprises millions in ...
Lightera, a leading provider of advanced optical fiber solutions, is proud to announce the launch of its latest innovation, the Micro Connect 125/245 1310 nm Bend Insensitive Polarization Maintaining ...
Lightmatter has released two pieces of technology that are aimed at speeding up the connections between AI chips.
Cerebras Systems, the pioneer in accelerating generative AI, has been awarded a new contract from the Defense Advanced ...
Lumentum today delivers best-in-class transmit and receive components designed to meet the demands of next-generation AI data centers. Transitioning from 100 Gbps to 200 Gbps lane speed enables data ...
Compound Semiconductor™ is an Angel Business Communications publication.
This innovation integrates the UV protection of inorganic sunscreens with the spreadability of organic sunscreens.
Some results have been hidden because they may be inaccessible to you
Show inaccessible results