Cerebras integrates wafer scale technology and Ranovus co-packaged optics technology in a new compute platform optimized for ...

CPO brings optical interconnects right to the chip New architecture shifts the fiber optic connections right to the board Co-packag ...

The computing system that Cerebras is building for DARPA will also feature “wafer scale co-packaged optics” from Ranovus. According to Reuters, the latter technology will be used to link together ...

Cerebras Systems, the pioneer in accelerating generative AI, has been awarded a new contract from the Defense Advanced ...

Lightera, a leading provider of advanced optical fiber solutions, is proud to announce the launch of its latest innovation, the Micro Connect 125/245 1310 nm Bend Insensitive Polarization Maintaining ...

The silicon photonics startup has announced new products to tackle interconnect bottlenecks costing enterprises millions in ...

ASE said in a press release that as AI applications rapidly expand, energy efficiency has become a key concern for data ...

Sivers Semiconductors has announced a partnership with O-Net Technologies to produce high-performance external laser sources, ...

One of the biggest advantages of this approach, Lightmatter says, is that communications between chips aren't limited to a so ...

Lightmatter has released two pieces of technology that are aimed at speeding up the connections between AI chips.

Consisting of an eight-tile 3D interposer with an integrated programmable waveguide network, the M1000 also contains 3D ...

Lumentum today delivers best-in-class transmit and receive components designed to meet the demands of next-generation AI data centers. Transitioning from 100 Gbps to 200 Gbps lane speed enables data ...