GlobalFoundries to establish new center for advanced packaging and testing
Gov. Kathy Hochul announced that GlobalFoundries (GF), a leading manufacturer of semiconductors located in Saratoga County, will invest $575 million to create a new center for
GlobalFoundries to build advanced packaging center in Malta, NY
New York Gov. Kathy Hochul announced on Friday that semiconductor manufacturer GlobalFoundries will be creating a new center for advanced packaging and testing in Saratoga County. GlobalFoundries is seeking to expand capabilities within its existing Malta facility.
GlobalFoundries Announces New York Advanced Packaging and Photonics Center
GlobalFoundries (Nasdaq: GFS) (GF) today announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. Supported by investments from the State of New York and the U.
GlobalFoundries to expand New York fab — announces new $575 million advanced packaging and photonics facility
GlobalFoundries is investing around $575 million to construct an advanced packaging and silicon photonics facility at its Malta, New York site.
GlobalFoundries plans $575M advanced packaging facility in New York
GlobalFoundries (NASDAQ:GFS) has announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. Supported by up to $20M in aid from the State of New York and up to $75Min direct funding from the U.
GlobalFoundries expanding with first-of-its-kind advanced packaging center in New York
Governor Kathy Hochul announced Friday that GlobalFoundries will invest $575 million to establish a new center for advanced packaging and testing.
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Department of Commerce Announces $1.4B to Support Semiconductor Advanced Packaging
The funds will enable new technologies to be validated and transitioned at scale.
MZ Technologies Unveils Next Generation Chiplet/Package Design Tool
MZ Technologies, a leading supplier of innovative solutions and methodologies for 2.5 and 3D design, today unveiled GENIO EVO ...
Taiwan Semiconductor Projects AI Revenue To Double In 2025, Highlights Advanced Packaging As Growth Driver: Analyst
Analyst Charles Shi reiterates a Buy rating for Taiwan Semiconductor with $225 price target. Company expects AI revenue to double in 2025.
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Nvidia CEO says advanced packaging needs are changing
TAICHUNG, Taiwan (Reuters) -- Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on ...