NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

Nvidia Corp CEO Jensen Huang (黃仁勳) is expected to miss the inauguration of US president-elect Donald Trump on Monday, bucking ...

Governor Kathy Hochul announced that GlobalFoundries will invest $575 million to establish the New York Advanced Packaging ...

GlobalFoundries in Malta will create a new center for semiconductor manufacturing, Governor Kathy Hochul announced on Friday.

The funds will enable new technologies to be validated and transitioned at scale.

Governor Kathy Hochul announced Friday that GlobalFoundries will invest $575 million to establish a new center for advanced ...

The US Department of Commerce has signed four separate non-binding preliminary memoranda of terms to award more than $246 ...

GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million investment in research and development over the next ...

The department announced Friday it had finalized a $93 million award to Infinera as part of the CHIPS and Science Act.

Read here for analysis of Shin-Etsu Chemical's prospects in PVC and semiconductor markets, highlighting growth opportunities ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

This will be an incredible year for innovation, driven by AI and for AI, and pushing the limits of fundamental physics.