Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

The funds will enable new technologies to be validated and transitioned at scale.

Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The ...

New York Gov. Kathy Hochul announced on Friday that semiconductor manufacturer GlobalFoundries will be creating a new center ...

GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million investment in research and development over the next ...

GlobalFoundries announced that it will build an advanced packaging and testing facility at its Malta, New York fab to support the growing demand for silicon built entirely within the United States.

1. Market Overview Advanced semiconductor packaging integrates cutting-edge technologies to improve chip functionality, density, and thermal management. Unlike traditional packaging, which ...

Micron Technology initiated construction on (January 8, 2025) of a new High-Bandwidth Memory (HBM) advanced packaging ...

Micron Technology, Inc. has commenced the construction of a High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, the first of its kind in the country. The groundbreaking ceremony ...

Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability ...