NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

Nvidia's most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a ...

The funds will enable new technologies to be validated and transitioned at scale.

GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million investment in research and development over the next ...

GlobalFoundries (NASDAQ:GFS) has announced plans to create a new center for advanced packaging and testing of U.S.-made ...

Sachin Tendulkar-backed RRP Electronics partners with Deca Technologies to enhance semiconductor capabilities and boost India ...

The US Department of Commerce has signed four separate non-binding preliminary memoranda of terms to award more than $246 ...

Governor Kathy Hochul announced Friday that GlobalFoundries will invest $575 million to establish a new center for advanced ...

GlobalFoundries in Malta will create a new center for semiconductor manufacturing, Governor Kathy Hochul announced on Friday.

Read here for analysis of Shin-Etsu Chemical's prospects in PVC and semiconductor markets, highlighting growth opportunities ...

The department announced Friday it had finalized a $93 million award to Infinera as part of the CHIPS and Science Act.

Nvidia Corp CEO Jensen Huang (黃仁勳) is expected to miss the inauguration of US president-elect Donald Trump on Monday, bucking ...