Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.

The funds will enable new technologies to be validated and transitioned at scale.

The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...

GlobalFoundries (NASDAQ:GFS) has announced plans to create a new center for advanced packaging and testing of U.S.-made ...

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

GlobalFoundries is investing around $575 million to construct an advanced packaging and silicon photonics facility at its Malta, New York site.

Read here for analysis of Shin-Etsu Chemical's prospects in PVC and semiconductor markets, highlighting growth opportunities ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

The ASU Research Park is one of three designated facilities nationwide and will focus on research and testing of new ...

Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The ...

The Department of Commerce said the newest semiconductor research facility will drive U.S. economic leadership and national ...

TAICHUNG, Taiwan (Reuters) -- Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on ...