US announces $1.4 bln support for next-generation semiconductor advanced packaging
The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of semiconductor advanced packaging.
GlobalFoundries Announces New York Advanced Packaging and Photonics Center
GlobalFoundries (Nasdaq: GFS) (GF) today announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. Supported by investments from the State of New York and the U.
GlobalFoundries to expand New York fab — announces new $575 million advanced packaging and photonics facility
GlobalFoundries is investing around $575 million to construct an advanced packaging and silicon photonics facility at its Malta, New York site.
GlobalFoundries expanding with first-of-its-kind advanced packaging center in New York
Governor Kathy Hochul announced Friday that GlobalFoundries will invest $575 million to establish a new center for advanced packaging and testing.
GlobalFoundries plans $575M advanced packaging facility in New York
GlobalFoundries (NASDAQ:GFS) has announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. Supported by up to $20M in aid from the State of New York and up to $75Min direct funding from the U.
Computer chip packaging and testing center comes to New York
New York Gov. Kathy Hochul announced on Friday that semiconductor manufacturer GlobalFoundries will be creating a new center ...
Nvidia CEO says its advanced packaging technology needs are changing
Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.
ASU-related projects nab $1.2 billion for new research tied to semiconductor packaging
The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors ...
TweakTown3h
NVIDIA ordering more CoWoS-L advanced packaging from TSMC: ready for more Blackwell AI GPUs
NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...
Manufacturing9h
Department of Commerce Announces $1.4B to Support Semiconductor Advanced Packaging
The funds will enable new technologies to be validated and transitioned at scale.
Federal funding boosts US chip packaging with $1.4B in CHIPS Act awards
The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...
Nvidia Continues Strong Demand for Taiwan Semiconductor's Advanced Packaging Despite Technology Shifts
Nvidia's demand for advanced packaging from Taiwan Semiconductor remains strong despite evolving technology; plans to use ...
The Saratogian14h
GlobalFoundries to establish new center for advanced packaging and testing
Gov. Kathy Hochul announced that GlobalFoundries (GF), a leading manufacturer of semiconductors located in Saratoga County, ...
Hoodline9h
GlobalFoundries Boosts New York's Tech Ecosystem with $575 Million Advanced Chip Center in Malta
GlobalFoundries invests $575 million in a new packaging and photonics center in Malta, NY, creating over 100 jobs.
Taiwan Semiconductor Projects AI Revenue To Double In 2025, Highlights Advanced Packaging As Growth Driver: Analyst
Analyst Charles Shi reiterates a Buy rating for Taiwan Semiconductor with $225 price target. Company expects AI revenue to double in 2025.
Applied Materials' SWOT analysis: ai-driven growth boosts semiconductor stock
Applied Materials, Inc. (NASDAQ:AMAT) is a leading provider of materials engineering solutions for the semiconductor, flat panel display, and solar photovoltaic industries. As the company navigates a ...