ARQUIMEA has demonstrated BrainChip’s Akida with a Prophesee event-based Metavision® camera on a low-power drone to detect ...

Designed as an evolutionary step beyond the previous HBM3 standard, JESD270-4 HBM4 will further enhance data processing rates while maintaining essential features such as higher bandwidth, power ...

The introduction of LPDDR5 in 2019 marked a major leap, delivering up to 6400Mbps and adding features like in-line ECC for ...

Creonic, the leading provider of high-performance IP cores for ASIC and FPGA technologies, has unveiled a bold new brand ...

Siemens Digital Industries Software today announced that Secafy has adopted Siemens’ full IC design flow consisting of its ...

The ODT-PVT-ULP-001C-3 provides simple and seamless integration, requiring just a single core-voltage supply and a digital ...

European and Japanese suppliers of semiconductor equipment are set to be targeted in the next round of tariffs by the US.

EnSilica, a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), provides an overview of the ...

The transaction will augment Cadence’s expanding design IP offerings, anchored by a leading portfolio of protocol and interface IP, memory interface IP, SerDes IP at the most advanced nodes, and ...

Next-generation AMD EPYC CPU, codenamed “Venice,” is the first HPC product to be brought up on TSMC’s next-generation N2 node ...

Now What? Convolutional Neural Networks (CNNs) have long dominated AI vision, powering applications from automotive ...

Designed for high-performance and energy-efficient video processing, VC9000D_LCEVC is used in conjunction with VeriSilicon’s ...