The funds will enable new technologies to be validated and transitioned at scale.
Advanced IC substrates (AICS ... However, finding these defects is difficult with an automated optical inspection (AOI) system. The reason: the grain boundaries on top of the rough copper generate ...
GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million investment in research and development over the next ...
YES announced today that it has received multiple orders of its VertaCure PLP systems for advanced packaging from a leading semiconductor manufacturer in Japan. These systems will be utilized ...
The company's potential restructuring of its advanced packaging supply chain includes a review of the existing system while establishing a new supply chain with the goal of strengthening its ...
The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors are protected.
Additionally, Elephantech has released the ELP04-PILOT, a compact inkjet system for advanced packaging processes. The system is designed to support materials development and process ...
The field of advanced packaging in particular is undergoing significant change, and this presents both opportunities and ...
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