Nvidia CEO says its advanced packaging technology needs are changing
Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.
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Department of Commerce Announces $1.4B to Support Semiconductor Advanced Packaging
The funds will enable new technologies to be validated and transitioned at scale.
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NVIDIA ordering more CoWoS-L advanced packaging from TSMC: ready for more Blackwell AI GPUs
NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...
US announces $1.4 bln support for next-generation semiconductor advanced packaging
The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...
Federal funding boosts US chip packaging with $1.4B in CHIPS Act awards
The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...
GlobalFoundries Announces New York Advanced Packaging and Photonics Center
GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million investment in research and development over the next ...
ASU-related projects nab $1.2 billion for new research tied to semiconductor packaging
The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors ...